品牌:
Intersil (英特矽尔)(14)
ST Microelectronics (意法半导体)(18)
Motorola (摩托罗拉)(19)
Renesas Electronics (瑞萨电子)(26)
National Semiconductor (美国国家半导体)(4)
Toshiba (东芝)(44)
Nexperia (安世)(3)
ADI (亚德诺)(21)
Fairchild (飞兆/仙童)(9)
Philips (飞利浦)(25)
TI (德州仪器)(22)
ROHM Semiconductor (罗姆半导体)(8)
Catalyst(13)
NXP (恩智浦)(26)
Data Delay Devices(2)
Allegro MicroSystems (急速微电子)(1)
Rochester (罗切斯特)(3)
Samsung (三星)(6)
Burr Brown(11)
Integrated Device Technology (艾迪悌)(10)
Maxim Integrated (美信)(4)
Linear Technology (凌力尔特)(3)
Cypress Semiconductor (赛普拉斯)(6)
Integrated Silicon Solution(ISSI)(5)
Semtech Corporation(2)
NEC (日本电气)(3)
Mitsubishi (三菱)(6)
Sipex (西伯斯)(3)
Pericom Semiconductor (百利通)(5)
Simtek(5)
Xicor(22)
HITACHI (日立)(7)
Cirrus Logic (思睿逻辑)(3)
GigaDevice (兆易)(1)
ATMEL (爱特美尔)(2)
UTC (友顺)(2)
Epson Electronics (爱普生)(2)
ON Semiconductor (安森美)(13)
Sanyo Semiconductor (三洋)(3)
Microchip (微芯)(5)
BSI(3)
Micron (镁光)(1)
Microsemi (美高森美)(2)
Bourns J.W. Miller (伯恩斯)(1)
California Eastern Laboratories(1)
Winbond Electronics (华邦电子股份)(15)
SK Hynix (海力士)(2)
muRata (村田)(2)
Unitrode(3)
Taiwan Semiconductor (台湾半导体)(5)
Exar Corporation (艾科嘉)(4)
Maxlinear (迈凌)(6)
Macronix International (旺宏电子)(2)
Harris(5)
Zentrum Mikroelektronik Dresden(2)
AMD (超微半导体)(4)
Intel (英特尔)(1)
SONY (索尼)(1)
Cherry Semiconductor(1)
Spansion (飞索半导体)(4)
Dallas Semiconductor (达拉斯半导体)(1)
Silan (士兰微电子)(1)
Holtek (合泰)(1)
Lansdale(1)
Dialog(1)
Traco Electronic(1)
Vishay Semiconductor (威世)(2)
IXYS Semiconductor(1)
Temic(1)
XP Power(1)
C&D Technologies(1)
Xilinx (赛灵思)(1)
Infineon (英飞凌)(1)
HOLT(3)
Nuvoton Technology (新唐)(2)
多选
封装:
SOP(471)
包装:
(471)
型号/品牌/封装
品类/描述
库存
价格(含税)
资料

©Copyright 2013-2025 亿配芯城(深圳)电子科技有限公司 粤ICP备17008354号

Scroll

对比栏

展开

对比

清空